Slicing

(1) Slice analysis of metal / nonmetal materials

objective

Observe the internal structure and defect analysis of the sample, electroplating process analysis, and the sliced sample can be used to observe the morphology and analyze the composition. Observe the internal structure by slicing, and verify the suspected abnormal cracks and cavities found in the sample.

Application scope

Ceramics, plastics, electroplating products, composite materials, welding parts, metal / non-metal products, auto parts and accessories, etc.

testing procedure

Sampling → cleaning → vacuum inlay → grinding → polishing → micro etching (if necessary) → metallographic microscope / scanning electron microscope observation / composition analysis.

Recommended standards

Ipc-tm 650 2.1.1, etc.

(2) Slice analysis of electronic components

Technical introduction

Slice analysis technology is one of the most common and important analysis methods in the PCB industry. It is usually used as the basis for objective inspection, research and judgment, such as work quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding failure causes and solutions, and evaluation of process improvement. If the outer layer quality or appearance is poor, it can be judged by optical detector or visual inspection; However, to confirm the quality of the inner layer or hole after pressing, it is necessary to determine the quality through slicing and make a preliminary analysis of the cause of the defect. Slice analysis is an important technology for PCB / PCBA failure analysis. Slice quality will directly affect the accuracy of failure location confirmation.

application area

Electronic industry, metal / plastic / ceramic products industry, automobile parts and accessories manufacturing industry, communication equipment, scientific research institutions, etc